In a bid to revolutionize the electronics industry, a Bengaluru-based startup, Helionis Labs, has developed an innovative heat-resistant material for electronics that could potentially address one of the biggest bottlenecks in modern electronics - heat management.
Founded in 2024 by materials scientist Tarun Jha, Helionis Labs has been working on developing a domestic solution to the problem of heat management in electronics. Jha, who completed his master's degree at the University of Florida and worked at companies in the United States and India, brought his expertise to the table to develop a novel approach to heat-resistant materials. After a year of intense research and development, the company reached a workable version of the product in 2025. Since then, it has been perfecting the material and the manufacturing process.
The market potential for Helionis Labs' innovative material is significant, with the company currently running pilots with two to three large LED manufacturers in India. The LED market is a strategic focus area for the company, given the well-known issue of heat-related failures in LED products and the presence of large, concentrated buyers. However, the larger opportunity lies in the electric vehicle market, where power electronics are safety-critical and run hot, making a domestic supplier valuable to manufacturers.
In June 2026, Helionis raised a pre-seed round from Transition VC, which will be used to further research and development, hire engineers, complete product certifications and reliability testing, and set up a pilot production line. As Helionis Labs looks to scale up its operations, it will face stiff competition from established suppliers abroad. To break into the market, the company will need to prove both the performance and cost-effectiveness of its material at scale. The next stage of the company's development will be critical, as it looks to move from a laboratory result to a supply business. Setting up a pilot line, obtaining certifications, and securing partnerships with manufacturers will be essential steps in this process. With its innovative heat-resistant material and additive manufacturing process, Helionis Labs is well-positioned to make a significant impact in the electronics industry.
According to Jha, "Heat is one of the biggest bottlenecks in modern electronics, from LED lighting to EV power systems and telecom infrastructure. At Helionis, we started from the materials level and rebuilt the thermal substrate stack around additive manufacturing and proprietary dielectric technology." The company's approach has the potential to address one of the biggest challenges facing modern electronics, and its success could have far-reaching implications for the industry as a whole.
